Epoxy Adhesive

Master Bond's flexibilized epoxy combines high strength with chemical and abrasion resistance

Comments Off on Epoxy Adhesive September 8, 2010
by DE staff

Master Bond introduced its Polymer System EP30D-7, a two component epoxy designed for bonding, sealing, coating, and encapsulating applications in the electronic, electrical, computer, metalworking, optical, electro-optical and oil/chemical processing industries.  Its lower exotherm also makes it suitable for casting and potting in cross section thicknesses of over one inch.

Serviceable over a temperature range of -100ºF to above +250ºF, EP30D-7 is designed to cure at room temperature or more rapidly at elevated temperatures with minimal shrinkage. This system is 100% reactive and contains no solvents or diluents. The cured elastomer is also electrical insulator, resists thermal cycling and is chemical resistant to water, fuels, and inorganic solvents. EP30D-7 has a tensile strength greater than 1,600 psi, a Shore A hardness of 90, an elongation of more than 40% and a dielectric constant exceeding 400 volts/mil.