Design Engineering



General DPN

Master Bond Inc. has introduced a two component epoxy adhesive/sealant for cryogenic applications. The EP29LPSP compound is able to withstand temperatures as low as 4K. Additionally, it is able to resist cryogenic shocks such as a room temperature shift down to liquid helium temperatures in a 5 to 10 min time period. The epoxy has a mix ratio of 100 to 65 by weight.

It cures at room temperatures, but best results are obtained if heat cured at 130° to 165°F for 6 to 8 h. Its mixed viscosity is 400 cps. It has a tensile strength of 6500 psi and a tensile modulus of >375,000 psi.


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