CRYOGENIC EPOXY ADHESIVE
Master Bond Inc. has introduced a two component epoxy adhesive/sealant for cryogenic applications. The EP29LPSP compound is able to withstand temperatures as low as 4K. Additionally, it is able to resist cryogenic shocks such as a room temperature shift down to liquid helium temperatures in a 5 to 10 min time period. The epoxy has a mix ratio of 100 to 65 by weight.