Design Engineering



General DPN

Master Bond has introduced EP30P, a two-component, transparent, low viscosity epoxy system for high performance bonding, sealing, coating, encapsulation and casting. The system has a 4 to 1 mix ratio by weight and is formulated to cure at room temperatures. Cures can be accelerated by the use of heat. EP30P is said to bond well to a wide variety of substrates including metals, glass, ceramics and many plastics. It has a service operating temperature range of -60¼ to 250¼F.

The epoxy is a 100% reactive system and contains no solvents or diluents. Tensile strength is >9500 psi.


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