Design Engineering

Distributed Modular I/O

By Design Engineering Staff   


Balluff introduces expandable architecture for CC-Link controls applications.

Balluff introduced its next generation of Distributed Modular I/O which features IP67 protection and industry standard connectors. Utilizing the vendor neutral standard IO-Link, the master block can communicate with up to 4 slave devices and then send their combined data back to the controller over the CC-Link network.

In lieu of a backplane, each slave device is connected to the CC-Link IO-Link master by an industry-standard M12 port, creating an IP67 connection. With the ability to be installed within a 20-meter radius from the master device, slave devices can be easily distributed across the machine without the use of the controls cabinets typically used in CC-Link network architectures.

The CC-Link IO-Link masters support daisy-chain connections as well as trunk & drop network architectures. The master has an intuitive push-button display that allows the user to view and set the station address and then the display can be locked from the controller to avoid tampering.



Stories continue below

Print this page

Related Stories