Design Engineering

Distributed Modular I/O

Balluff introduces expandable architecture for CC-Link controls applications.

October 30, 2012   by Design Engineering Staff

Balluff introduced its next generation of Distributed Modular I/O which features IP67 protection and industry standard connectors. Utilizing the vendor neutral standard IO-Link, the master block can communicate with up to 4 slave devices and then send their combined data back to the controller over the CC-Link network.

In lieu of a backplane, each slave device is connected to the CC-Link IO-Link master by an industry-standard M12 port, creating an IP67 connection. With the ability to be installed within a 20-meter radius from the master device, slave devices can be easily distributed across the machine without the use of the controls cabinets typically used in CC-Link network architectures.

The CC-Link IO-Link masters support daisy-chain connections as well as trunk & drop network architectures. The master has an intuitive push-button display that allows the user to view and set the station address and then the display can be locked from the controller to avoid tampering.
www.balluff.com


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