Design Engineering

Epoxy Adhesive

By DE staff   

General adhesives

Master Bond's flexibilized epoxy combines high strength with chemical and abrasion resistance

Master Bond introduced its Polymer System EP30D-7, a two component epoxy designed for bonding, sealing, coating, and encapsulating applications in the electronic, electrical, computer, metalworking, optical, electro-optical and oil/chemical processing industries.  Its lower exotherm also makes it suitable for casting and potting in cross section thicknesses of over one inch.

Serviceable over a temperature range of -100ºF to above +250ºF, EP30D-7 is designed to cure at room temperature or more rapidly at elevated temperatures with minimal shrinkage. This system is 100% reactive and contains no solvents or diluents. The cured elastomer is also electrical insulator, resists thermal cycling and is chemical resistant to water, fuels, and inorganic solvents. EP30D-7 has a tensile strength greater than 1,600 psi, a Shore A hardness of 90, an elongation of more than 40% and a dielectric constant exceeding 400 volts/mil.



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